On November 5, BOE A said during separate research from JP Morgan and China Merchants Fund that the company has now completed the entire process process of glass-based seal loading boards, such as high depth-to-width ratio TGV opening, deep hole copper filling, low stress metal wiring, high level numerical compression, high density wiring, and low stress cutting, and has complete glass-based seal loading board manufacturing process capabilities. At present, the company's test line has fully automated equipment. A 24-layer glass-based loading board with a size of more than 100 x 100 mm has been produced and samples have been sent, and the customer samples have passed the relevant reliability tests.

On November 5, BOE A said during separate research from JP Morgan and China Merchants Fund that the company has now completed the entire process process of glass-based seal loading boards, such as high depth-to-width ratio TGV opening, deep hole copper filling, low stress metal wiring, high level numerical compression, high density wiring, and low stress cutting, and has complete glass-based seal loading board manufacturing process capabilities. At present, the company's test line has fully automated equipment. A 24-layer glass-based loading board with a size of more than 100 x 100 mm has been produced and samples have been sent, and the customer samples have passed the relevant reliability tests.