Ceva Launches NeuPro NPU Portfolio To Deliver Up To 2x Higher AI Throughput Per mm² And 50% Improvement In Energy Efficiency

Built on a common architecture and unified software stack, the new portfolio is designed to support increasingly demanding multimodal, generative and agentic AI workloads across Physical AI applications, from always-on sensing to advanced edge systems. The new architecture also marks Ceva's expansion into AI infrastructure, enabling intelligent memory, connectivity and data-processing silicon, as well as custom AI inference processors for cloud and data centers.

Physical AI systems increasingly rely on multiple AI models and intelligent agents working together, with perception and real-time responses close to the sensor and more complex reasoning and orchestration distributed across devices, edge systems and the cloud. This shift toward hybrid AI is accelerating. Yet wherever inference takes place, a common challenge remains: the power and performance cost of the compute itself and of moving data to and from it. At the sensor, that cost is measured in microwatts and square millimeters; in the data center, in megawatts and memory bandwidth.  The same constraint appears in different forms, which calls for neural processing optimized for each workload, supported by a common architecture and software environment.

The next-generation NeuPro portfolio addresses both: a range of engines sized for different points in the system, and one way to develop for all of them. A unified software development kit spans the portfolio so semiconductor designers can match an engine to each part of their system or combine several within one SoC while preserving their software investment.