GroQ is considering applying 3D stacked DRAM packaging technology to the next generation of chips. This means DRAM will be used to replace existing SRAM. Industry insiders interpreted this move as a significant increase in chip capacity by getting rid of the current SRAM-centered chip design. According to reports, SRAM is fast but has limited capacity, while DRAM is relatively slow, but it is more suitable for implementing high-capacity chips. 3D packaging technology stacks multiple semiconductor chips vertically rather than flat to form a complete chip. Compared with traditional 2D packaging, it can reduce the chip surface area and improve energy efficiency.

GroQ is considering applying 3D stacked DRAM packaging technology to the next generation of chips. This means DRAM will be used to replace existing SRAM. Industry insiders interpreted this move as a significant increase in chip capacity by getting rid of the current SRAM-centered chip design. According to reports, SRAM is fast but has limited capacity, while DRAM is relatively slow, but it is more suitable for implementing high-capacity chips. 3D packaging technology stacks multiple semiconductor chips vertically rather than flat to form a complete chip. Compared with traditional 2D packaging, it can reduce the chip surface area and improve energy efficiency.