Intron Technology Showcases Microelectronics Modules at Hong Kong Electronics Fair 2026

• Intron Technology showcased two microelectronics solutions at the Hong Kong Electronics Fair, held October 13-16, 2026.
• The Embedded Power Module targets electric-vehicle drive and high-voltage control systems with a compact design, high power density and efficient thermal management.
• The High-Integration COB 3D Perception Module demonstrated high-precision depth imaging and real-time spatial perception for embodied intelligence applications.

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