The Morgan Stanley Research Report thoroughly analyzes Intel's foundry's advanced packaging roadmap, focusing on EMIB‑M and EMIB‑T two-generation embedded multi-chip interconnect bridge technology, both of which target high-performance AI accelerator scenarios. Analysts said that EmiB‑M's main customers will be AWS's Trainium3 accelerator, upcoming Trainium4 chips, and Amazon's self-developed server CPUs. Morgan Stanley's analysis sees AWS as the primary anticipated customer for EMIB‑M and EMIB‑T, while other hyperscale cloud vendors are also evaluating this package solution. Google has validated EmiB‑T for the next generation TPUv9, further driving the development of Intel's foundry advanced packaging business. However, the project still has quite a few execution risks: the timeline for custom chips and next-generation packaging nodes is often delayed. Neither Intel nor AWS have officially confirmed these customer orders.

The Morgan Stanley Research Report thoroughly analyzes Intel's foundry's advanced packaging roadmap, focusing on EMIB‑M and EMIB‑T two-generation embedded multi-chip interconnect bridge technology, both of which target high-performance AI accelerator scenarios. Analysts said that EmiB‑M's main customers will be AWS's Trainium3 accelerator, upcoming Trainium4 chips, and Amazon's self-developed server CPUs. Morgan Stanley's analysis sees AWS as the primary anticipated customer for EMIB‑M and EMIB‑T, while other hyperscale cloud vendors are also evaluating this package solution. Google has validated EmiB‑T for the next generation TPUv9, further driving the development of Intel's foundry advanced packaging business. However, the project still has quite a few execution risks: the timeline for custom chips and next-generation packaging nodes is often delayed. Neither Intel nor AWS have officially confirmed these customer orders.