GlobalFoundries Reaches Deal With TSMC To Create U.S.-Based Supply Of Silicon Interposers For TSMC's CoWoS Advanced Packaging Ecosystem

GlobalFoundries (NASDAQ:GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.