According to people familiar with the matter, Broadcom's Wall Street underwriting team is preparing to raise 60 billion US dollars in financing for a new AI chip. The beneficiaries include Anthropic and other companies. People familiar with the matter said that a number of banks involved in this huge debt plan will soon issue underwriting letters of 42 billion US dollars of Class A priority guarantee bonds. Sources said that Blackstone Group is leading the $18 billion Class B subprime debt, and many of Blackstone's funds have promised to invest 9 billion US dollars, and the remaining portion is planned to be distributed abroad. A Broadcom spokesperson declined to comment.

According to people familiar with the matter, Broadcom's Wall Street underwriting team is preparing to raise 60 billion US dollars in financing for a new AI chip. The beneficiaries include Anthropic and other companies. People familiar with the matter said that a number of banks involved in this huge debt plan will soon issue underwriting letters of 42 billion US dollars of Class A priority guarantee bonds. Sources said that Blackstone Group is leading the $18 billion Class B subprime debt, and many of Blackstone's funds have promised to invest 9 billion US dollars, and the remaining portion is planned to be distributed abroad. A Broadcom spokesperson declined to comment.