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BOE A announced the Investor Relations Activity Record Form. The company's glass-based seal loading board test line has been completed, the production of 24-layer substrates exceeding 100 x 100 mm in size has been completed, and the factory has passed the reliability test. Currently, we are testing the electrical performance of the chip after the previous generation with the customer. After packaging the carrier board and the actual CPU and GPU chips, they are put into the server for operation. The conditions for mass production decisions include customer order volume and yield guarantee. The goal is to achieve mass production investment conditions in the first half or first quarter of next year. The company has invested nearly 1 billion yuan to build a pilot line to achieve TGV drilling, copper plating, ABF layering, and full back-up chain. In terms of the MicroLED short-range optical interconnection system, the functional verification demo of light source emission to optical fiber coupling and 19-core optical fiber transmission has been completed. It is expected that the entire system and eye map display from transmission to reception will be completed by the end of the year. The next year will promote platform construction and industrial investment in short-range optical interconnection products and optoelectronic co-encapsulation technology. LCD panel BOM costs are expected to rise 5%-8% in the second half of the year, and the company will absorb the pressure by adjusting product prices. The “mirror-free” OLED flexible screen has reduced crease depth and slope by 60%, increased mechanical strength by 50%, and can withstand repeated bending at minus 40℃. It has been certified by SGS and used in cooperation with leading domestic customers for the brand's flagship series products.

Zhitongcaijing·09/22/2026 13:01:28
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BOE A announced the Investor Relations Activity Record Form. The company's glass-based seal loading board test line has been completed, the production of 24-layer substrates exceeding 100 x 100 mm in size has been completed, and the factory has passed the reliability test. Currently, we are testing the electrical performance of the chip after the previous generation with the customer. After packaging the carrier board and the actual CPU and GPU chips, they are put into the server for operation. The conditions for mass production decisions include customer order volume and yield guarantee. The goal is to achieve mass production investment conditions in the first half or first quarter of next year. The company has invested nearly 1 billion yuan to build a pilot line to achieve TGV drilling, copper plating, ABF layering, and full back-up chain. In terms of the MicroLED short-range optical interconnection system, the functional verification demo of light source emission to optical fiber coupling and 19-core optical fiber transmission has been completed. It is expected that the entire system and eye map display from transmission to reception will be completed by the end of the year. The next year will promote platform construction and industrial investment in short-range optical interconnection products and optoelectronic co-encapsulation technology. LCD panel BOM costs are expected to rise 5%-8% in the second half of the year, and the company will absorb the pressure by adjusting product prices. The “mirror-free” OLED flexible screen has reduced crease depth and slope by 60%, increased mechanical strength by 50%, and can withstand repeated bending at minus 40℃. It has been certified by SGS and used in cooperation with leading domestic customers for the brand's flagship series products.