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MACOM Introduces 3.2T Chipset Solution for High Speed Optical Connectivity

Barchart·09/17/2026 07:15:00
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LOWELL, Mass., Sept. 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a front end chipset solution for 3.2T applications, designed to accelerate the development of next generation optical interconnects for AI infrastructure, cloud data centers and high speed networking applications.

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