Today, Huawei released the world's first 3D data center, published the “3D Data Center” monograph book, and opened the “3D Data Center Overview Design Gallery”. The 3D data center draws on the concept of strict separation between the “power layer” and “production layer” of chip factories, and vertically superimposes each functional space deployed horizontally in traditional data centers to form a four-layer architecture of cooling layer, IT equipment layer, power supply layer, and power backup layer from the bottom up. Wang Tao, vice chairman and rotating chairman of Huawei, said that the large 10 trillion parameter model and rapidly growing token demand place higher demands on AI infrastructure, and the Shengteng supernode cluster with 100,000 cards or more will become the basic configuration. The 3D data center supports the supercomputing power factory of the Shengteng supernode cluster through hierarchical decoupling and three-dimensional stacking.

Today, Huawei released the world's first 3D data center, published the “3D Data Center” monograph book, and opened the “3D Data Center Overview Design Gallery”. The 3D data center draws on the concept of strict separation between the “power layer” and “production layer” of chip factories, and vertically superimposes each functional space deployed horizontally in traditional data centers to form a four-layer architecture of cooling layer, IT equipment layer, power supply layer, and power backup layer from the bottom up. Wang Tao, vice chairman and rotating chairman of Huawei, said that the large 10 trillion parameter model and rapidly growing token demand place higher demands on AI infrastructure, and the Shengteng supernode cluster with 100,000 cards or more will become the basic configuration. The 3D data center supports the supercomputing power factory of the Shengteng supernode cluster through hierarchical decoupling and three-dimensional stacking.