On September 14, it was reported that Samsung Electric and Qualcomm are jointly developing “organic bridge” technology for advanced packaging of AI chips. The two sides have been carrying out R&D and verification work for more than a year. Samsung Electric is also developing 2.1D packaging substrates based on organic bridges at the same time as other customers. According to reports, Samsung Electric plans to embed an organic bridge with 5 to 7 layers of rewiring into the FC-BGA substrate, with the goal of reducing line width and line spacing to 1.5 to 2 microns. This technology is seen as a potential alternative to Intel's EMIB silicon bridge packaging technology.

On September 14, it was reported that Samsung Electric and Qualcomm are jointly developing “organic bridge” technology for advanced packaging of AI chips. The two sides have been carrying out R&D and verification work for more than a year. Samsung Electric is also developing 2.1D packaging substrates based on organic bridges at the same time as other customers. According to reports, Samsung Electric plans to embed an organic bridge with 5 to 7 layers of rewiring into the FC-BGA substrate, with the goal of reducing line width and line spacing to 1.5 to 2 microns. This technology is seen as a potential alternative to Intel's EMIB silicon bridge packaging technology.