Tianyue Advanced said at the 2026 semi-annual performance briefing held on September 11 that as AI computing power density continues to increase, while advanced packaging achieves a higher degree of integration, the pressure on cooling and thermal management has also increased markedly. Silicon carbide has characteristics such as high thermal conductivity and high temperature resistance, and is used in advanced packaging-related heat dissipation and intermediate layers. It helps improve heat transfer efficiency, supports system stability at higher power densities, and takes into account requirements such as integrated density and package shape optimization in some solutions. The company has continued to deploy around advanced packaging and cooling intermediaries, etc., and is also promoting cooperation with customers. Related work is being promoted in collaboration with downstream customers.

Tianyue Advanced said at the 2026 semi-annual performance briefing held on September 11 that as AI computing power density continues to increase, while advanced packaging achieves a higher degree of integration, the pressure on cooling and thermal management has also increased markedly. Silicon carbide has characteristics such as high thermal conductivity and high temperature resistance, and is used in advanced packaging-related heat dissipation and intermediate layers. It helps improve heat transfer efficiency, supports system stability at higher power densities, and takes into account requirements such as integrated density and package shape optimization in some solutions. The company has continued to deploy around advanced packaging and cooling intermediaries, etc., and is also promoting cooperation with customers. Related work is being promoted in collaboration with downstream customers.