According to the Zhitong Finance App, Huaneng International Power Co., Ltd. (00902.HK) issued an announcement that Huaneng International Power Co., Ltd. will publicly issue science and technology innovation company bonds (Phase II) to professional investors in 2026, with an issuance scale of no more than RMB 1.5 billion (including 1.5 billion yuan). The current bond is divided into two types. The issuance period for type 1 is 10 years, and the issuance period for type 2 is 15 years. The issuer and lead underwriter conducted an offline coupon interest rate inquiry from professional institutional investors on September 9, 2026. Based on the results of the offline inquiry bookkeeping with professional institutional investors, after full consultation and careful judgment between the issuer and the lead underwriter, it was finally determined that the coupon interest rate for the current bond type 1 (bond abbreviation: 26HPI03K, code: 246046.SH) was 1.95%, and the current bond type 2 (bond abbreviation: 26HPI04K, code: 246047.SH) was not actually issued.

According to the Zhitong Finance App, Huaneng International Power Co., Ltd. (00902.HK) issued an announcement that Huaneng International Power Co., Ltd. will publicly issue science and technology innovation company bonds (Phase II) to professional investors in 2026, with an issuance scale of no more than RMB 1.5 billion (including 1.5 billion yuan). The current bond is divided into two types. The issuance period for type 1 is 10 years, and the issuance period for type 2 is 15 years. The issuer and lead underwriter conducted an offline coupon interest rate inquiry from professional institutional investors on September 9, 2026. Based on the results of the offline inquiry bookkeeping with professional institutional investors, after full consultation and careful judgment between the issuer and the lead underwriter, it was finally determined that the coupon interest rate for the current bond type 1 (bond abbreviation: 26HPI03K, code: 246046.SH) was 1.95%, and the current bond type 2 (bond abbreviation: 26HPI04K, code: 246047.SH) was not actually issued.