Lanqi Technology announced the Investor Relations Activity Record Form. In July, the company took the lead in trial production of CXL3.2MXC chips in the industry and successfully introduced the next generation of Samsung and SK Hynix CXL products. It is expected that 2027 will enter the first year of CXL scale commercialization. The PCIeSwitch chip is expected to complete the engineering sample stream within the year. The PCIe6.x/CXL3.xRetimer chip has completed mass production and is included in the PCI-SIG supplier list. It is planned to complete the PCIe7.0 ReTimer and Ethernet PhyreTimer chip engineering sample streams this year. Samples of the sixth generation of DDR5 RCD chips have been delivered, and the support rate has reached 9,200 MT/s. The fifth generation has begun large-scale shipments, with the third and fourth generation accounting for more than 50% of total shipments. The second-generation MRCD/MDB chip is in the large-scale trial stage, and large-scale quantities will have to wait for the next generation CPU to be mass-produced next year. The clock chip has received a mass production order, and the high-precision RTC chip is expected to complete the engineering sample stream in the second half of the year. Increased CPU configuration ratio for AI servers will drive demand for memory modules and interconnect chips.

Lanqi Technology announced the Investor Relations Activity Record Form. In July, the company took the lead in trial production of CXL3.2MXC chips in the industry and successfully introduced the next generation of Samsung and SK Hynix CXL products. It is expected that 2027 will enter the first year of CXL scale commercialization. The PCIeSwitch chip is expected to complete the engineering sample stream within the year. The PCIe6.x/CXL3.xRetimer chip has completed mass production and is included in the PCI-SIG supplier list. It is planned to complete the PCIe7.0 ReTimer and Ethernet PhyreTimer chip engineering sample streams this year. Samples of the sixth generation of DDR5 RCD chips have been delivered, and the support rate has reached 9,200 MT/s. The fifth generation has begun large-scale shipments, with the third and fourth generation accounting for more than 50% of total shipments. The second-generation MRCD/MDB chip is in the large-scale trial stage, and large-scale quantities will have to wait for the next generation CPU to be mass-produced next year. The clock chip has received a mass production order, and the high-precision RTC chip is expected to complete the engineering sample stream in the second half of the year. Increased CPU configuration ratio for AI servers will drive demand for memory modules and interconnect chips.