During CSEAC2026, China Micro announced the launch of a number of new self-developed high-end microprocessing equipment, covering key fields such as extremely high depth-to-width ratio etching, plasma-enhanced chemical vapor deposition, atomic layer deposition, thin metal film deposition, and silicon carbide epitaxial.

During CSEAC2026, China Micro announced the launch of a number of new self-developed high-end microprocessing equipment, covering key fields such as extremely high depth-to-width ratio etching, plasma-enhanced chemical vapor deposition, atomic layer deposition, thin metal film deposition, and silicon carbide epitaxial.