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AUO to showcase Micro LED co-packaged optics module at SEMICON Taiwan

PUBT·08/31/2026 12:05:06
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AUO to showcase Micro LED co-packaged optics module at SEMICON Taiwan
  • AUO will showcase optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026 on Sept. 2-4.
  • Micro LED co-packaged optics module targets AI data-center interconnects up to 10 meters, aiming to cut power use and thermal load.
  • Glass core substrates exhibit with Corning highlights packaging for larger AI processor dies, higher-density interconnects, lower signal loss.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. AUO Corporation published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202608310800PRIMZONEFULLFEED9818420) on August 31, 2026, and is solely responsible for the information contained therein.