Xu Guojin, Deputy General Manager of Advanced Packaging Technology Development at TSMC, said today that the underlying architecture of optical transceivers is undergoing structural transformation. Silicon photons have become the mainstream model. The market share is expected to exceed 50% in 2027, while silicon photonics is ultimately reflected in co-packaged optics, and manufacturers will start mass production in the second half of this year.

Xu Guojin, Deputy General Manager of Advanced Packaging Technology Development at TSMC, said today that the underlying architecture of optical transceivers is undergoing structural transformation. Silicon photons have become the mainstream model. The market share is expected to exceed 50% in 2027, while silicon photonics is ultimately reflected in co-packaged optics, and manufacturers will start mass production in the second half of this year.