SK Hynix is introducing advanced packaging technology, including Intel EMIB, to its next-generation HBM solutions, and plans to finally enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix Packaging Engineering Vice President Jaesik Lee presented a report entitled “Advanced Packaging for High-Bandwidth Memory”, detailing how the company will use advanced packaging technology to accelerate its HBM product roadmap. Currently, SK Hynix is exploring hybrid bonding and other methods to break through the limitations of 16-layer stacking. In the future, SK Hynix also plans to solve power consumption challenges by increasing the number of TSVs, increasing the IO speed of integrated logic processes, and optimizing the power distribution network.

SK Hynix is introducing advanced packaging technology, including Intel EMIB, to its next-generation HBM solutions, and plans to finally enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix Packaging Engineering Vice President Jaesik Lee presented a report entitled “Advanced Packaging for High-Bandwidth Memory”, detailing how the company will use advanced packaging technology to accelerate its HBM product roadmap. Currently, SK Hynix is exploring hybrid bonding and other methods to break through the limitations of 16-layer stacking. In the future, SK Hynix also plans to solve power consumption challenges by increasing the number of TSVs, increasing the IO speed of integrated logic processes, and optimizing the power distribution network.