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NXP breaks ground on Petaling Jaya assembly, test plant expansion in Malaysia

PUBT·08/12/2026 15:10:16
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NXP breaks ground on Petaling Jaya assembly, test plant expansion in Malaysia
  • NXP Semiconductors broke ground on an assembly and test factory expansion in Petaling Jaya, Malaysia.
  • Project adds about 500,000 square feet, lifting total production space to about 900,000 square feet.
  • Production ramp targeted for Q1 2028; full-capacity output expected to more than double versus current levels.
  • Highly automated “smart factory” planned, using automated material handling and advanced quality systems to raise efficiency.
  • Expansion increases internal back-end capacity, supporting a hybrid manufacturing strategy and broader supply-chain resilience.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. NXP Semiconductors NV published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202608120900PRIMZONEFULLFEED9808630) on August 12, 2026, and is solely responsible for the information contained therein.