Changes in US stocks | Stock prices rose more than 6% and TSM.US developed Intel EMIB competition

The Zhitong Finance App learned that on Thursday, the TSM.US stock price rose by more than 3%, with an intraday increase of up to 8%. As of press time, the increase had narrowed to 6%. According to reports, two people familiar with the matter revealed that TSMC is developing a product similar to Intel's existing advanced chip packaging technology, which shows that the world's leading chip manufacturer is concerned about competition from competitors. Chip packaging is the final stage in chip production, where different silicon wafers are assembled and wired into a single unit so that they can work as a whole and connect to other parts of the computer. People familiar with the matter said that within TSMC, engineers refer to this advanced packaging project as a “class EMIB” and have discussed this plan with some customers.