The 2026 IPC CEMAC Electronics Manufacturing Annual Conference will be held in Shanghai on September 17-18. The conference will focus on core directions such as advanced electronic packaging interconnection and system integration, digital and intelligent manufacturing, electronic assembly and high-reliability manufacturing. During this period, a number of new industry standards such as the IPC-6931 optical module printing board acceptance specification will be released, the preparation of a white paper on glass substrate technology will be announced, and a demonstration production line for intelligent manufacturing will be demonstrated.

The 2026 IPC CEMAC Electronics Manufacturing Annual Conference will be held in Shanghai on September 17-18. The conference will focus on core directions such as advanced electronic packaging interconnection and system integration, digital and intelligent manufacturing, electronic assembly and high-reliability manufacturing. During this period, a number of new industry standards such as the IPC-6931 optical module printing board acceptance specification will be released, the preparation of a white paper on glass substrate technology will be announced, and a demonstration production line for intelligent manufacturing will be demonstrated.