The HKSAR Government and the Ministry of Industry and Information Technology today signed the “Cooperation Agreement on Promoting the Joint Construction of a Manufacturing Innovation Center between the Ministry and Hong Kong” at the HKSAR Government headquarters. The “Cooperation Agreement” aims to effectively promote the “Cooperation Agreement on Developing New Quality Productivity and Promoting New Industrialization” signed by the two sides in September 2024, deepening industrial cooperation between the Mainland and Hong Kong, promoting better integration and service of Hong Kong into the overall development of the country, and jointly supporting the construction of a manufacturing innovation center in Hong Kong. The Secretary for Innovation, Technology and Industry, Sun Dong, said that this year's budget has proposed reserving funds to build the first overseas national manufacturing innovation center in Hong Kong. The goal is to promote breakthroughs in key technologies, promote industrialization of achievements, and gather international talents. In this regard, the HKSAR Government supports the Hong Kong Microelectronics Research and Development Institute to assume the heavy responsibility of leading the operation of the Innovation Center based on the existing foundation. The move will match the country's technology and industrial planning priorities and build on Hong Kong's existing semiconductor ecosystem. The two sides also met before the signing ceremony to discuss in depth how Hong Kong can better connect with the country's new industrialization development plan and collaborate with mainland cities in the Greater Bay Area, and integrate and serve the country's modern industrial system.

The HKSAR Government and the Ministry of Industry and Information Technology today signed the “Cooperation Agreement on Promoting the Joint Construction of a Manufacturing Innovation Center between the Ministry and Hong Kong” at the HKSAR Government headquarters. The “Cooperation Agreement” aims to effectively promote the “Cooperation Agreement on Developing New Quality Productivity and Promoting New Industrialization” signed by the two sides in September 2024, deepening industrial cooperation between the Mainland and Hong Kong, promoting better integration and service of Hong Kong into the overall development of the country, and jointly supporting the construction of a manufacturing innovation center in Hong Kong. The Secretary for Innovation, Technology and Industry, Sun Dong, said that this year's budget has proposed reserving funds to build the first overseas national manufacturing innovation center in Hong Kong. The goal is to promote breakthroughs in key technologies, promote industrialization of achievements, and gather international talents. In this regard, the HKSAR Government supports the Hong Kong Microelectronics Research and Development Institute to assume the heavy responsibility of leading the operation of the Innovation Center based on the existing foundation. The move will match the country's technology and industrial planning priorities and build on Hong Kong's existing semiconductor ecosystem. The two sides also met before the signing ceremony to discuss in depth how Hong Kong can better connect with the country's new industrialization development plan and collaborate with mainland cities in the Greater Bay Area, and integrate and serve the country's modern industrial system.