According to the Guojin Securities Research Report, the mSAP process is suitable for application scenarios with high line width and line spacing requirements. The technical difficulties are mainly copper base, electroplating, and erosion. The initial application scenarios of mSAP are mainly consumer electronics, and AI optical module+NV-Cowop is expected to drive the rapid expansion of MSAP PCB. For the driving aspect of upstream materials, mSAP-PCB is recommended to focus on ① direct writing lithography, ② electroplating line, ③ carrier copper foil, ④ potion, ⑤ low-CtE electronic cloth, ⑥ low-dk second-generation cloth, HVLP4 copper foil, etc.

According to the Guojin Securities Research Report, the mSAP process is suitable for application scenarios with high line width and line spacing requirements. The technical difficulties are mainly copper base, electroplating, and erosion. The initial application scenarios of mSAP are mainly consumer electronics, and AI optical module+NV-Cowop is expected to drive the rapid expansion of MSAP PCB. For the driving aspect of upstream materials, mSAP-PCB is recommended to focus on ① direct writing lithography, ② electroplating line, ③ carrier copper foil, ④ potion, ⑤ low-CtE electronic cloth, ⑥ low-dk second-generation cloth, HVLP4 copper foil, etc.