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IPO News | Tongbo Technology's Hong Kong Stock IPO Prospectus Expires

Zhitongcaijing·07/27/2026 22:33:08
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The Zhitong Finance App learned that the Hong Kong stock prospectus submitted by Jiangxi Tongbo Technology Co., Ltd. (abbreviation: Tongbo Technology) on January 28, 2026 expired on July 28, 2026. Guojin Securities (Hong Kong) was its sole sponsor at the time of submission.

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According to the previous prospectus, Tongbo Technology is an electrolytic copper foil solution provider, focusing on the design, R&D, production and sales of high-performance electrolytic copper foil. According to Frost & Sullivan, the company is the ninth largest producer of electrolytic copper foil in China in terms of sales volume in 2024, with a market share of about 4.0%. Based on 2024 sales volume, the company is also the second largest producer of high-performance lithium battery copper foil in China, with a market share of 13.0%.