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Intel: Reached a technical cooperation agreement on advanced semiconductor packaging and reached a cooperation agreement with Lansi Technology. The scope of cooperation covers chip components related to artificial intelligence personal computers and servers.

Zhitongcaijing·07/24/2026 16:57:06
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Intel: Reached a technical cooperation agreement on advanced semiconductor packaging and reached a cooperation agreement with Lansi Technology. The scope of cooperation covers chip components related to artificial intelligence personal computers and servers.