AMD and Cerebras Systems have unveiled a collaboration aimed at enhancing AI inference infrastructure through a new disaggregated solution. This partnership integrates AMD’s Helios™ rackscale solutions with Cerebras’ Wafer-Scale Engine, promising ultra-low latency and high throughput for AI applications. The joint solution, which will be available via Cerebras Cloud in late 2026, optimizes the workflow by independently enhancing throughput with AMD’s technology and accelerating token generation with Cerebras’ engine. This new development targets the rising demand for AI inference capabilities that require diverse infrastructure to accommodate variable workloads and scale demands efficiently.
In other trading, Tongfu MicroelectronicsLtd (SZSE:002156) was a notable mover up 9.8% and ending trading at CN¥76.64. In the meantime, STMicroelectronics (ENXTPA:STMPA) trailed, down 17.7% to finish the session at €47.94. On Thursday, the company announced earnings guidance for Q3 and Q4 2026, projecting significant revenue growth above typical seasonality in H2.
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