Amkor forms multiyear advanced packaging partnership with Nvidia

• Amkor Technology signed a multi-year strategic partnership with Nvidia to develop advanced semiconductor packaging and test for next-generation AI platforms.
• Nvidia will make a prepayment tied to a capacity agreement to support an expansion of Amkor’s U.S. advanced packaging footprint in Arizona.
• The companies will align long-term roadmaps around high-density interconnects and next-generation heterogeneous integration to scale AI infrastructure production.
• The deal targets more turnkey U.S. packaging and test capability, aiming to improve supply-chain resilience alongside Amkor’s existing Asia operations.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Amkor Technology Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260723873230) on July 23, 2026, and is solely responsible for the information contained therein.