According to the Institute of Metals Research of the Chinese Academy of Sciences, the Copper-based Materials and Homogenization Research Group of the Belarusian National Academy of Sciences and the Scientific-Practical Materials Research Center of the Belarusian National Academy of Sciences and Jiangxi Nile Copper Co., Ltd. have recently jointly developed an electrochemical deposition additive manufacturing technology that can efficiently grow porous copper absorbent core structures on the surface of the Omega channel, and achieved controllable adjustment of the gradient distribution of porous copper pore sizes from nano to microns using atomic-level stacking methods. The capillary force of the electrochemically additive gradient suction core structure prepared by this method is 2 times higher than that of the traditional copper powder sintered suction core structure, and the heat dissipation power of a single tube with a gradient suction core structure is 1 times higher than that of a traditional groove tube. This method solves the problem of integrated manufacturing of Omega channels and gradient suction core structures, and provides strong support for the application of next-generation high-conductivity copper heat pipes in AI computing power center cooling.

According to the Institute of Metals Research of the Chinese Academy of Sciences, the Copper-based Materials and Homogenization Research Group of the Belarusian National Academy of Sciences and the Scientific-Practical Materials Research Center of the Belarusian National Academy of Sciences and Jiangxi Nile Copper Co., Ltd. have recently jointly developed an electrochemical deposition additive manufacturing technology that can efficiently grow porous copper absorbent core structures on the surface of the Omega channel, and achieved controllable adjustment of the gradient distribution of porous copper pore sizes from nano to microns using atomic-level stacking methods. The capillary force of the electrochemically additive gradient suction core structure prepared by this method is 2 times higher than that of the traditional copper powder sintered suction core structure, and the heat dissipation power of a single tube with a gradient suction core structure is 1 times higher than that of a traditional groove tube. This method solves the problem of integrated manufacturing of Omega channels and gradient suction core structures, and provides strong support for the application of next-generation high-conductivity copper heat pipes in AI computing power center cooling.