Samsung Electronics has selected Dutch semiconductor back-end equipment company BESI as its primary partner and has begun introducing 50 D2W hybrid bonding machines. These devices are expected to be installed on the mass production line at the P5 plant in Pyeongtaek Park by the end of this year to produce next-generation high-bandwidth memories and logic semiconductors.

Samsung Electronics has selected Dutch semiconductor back-end equipment company BESI as its primary partner and has begun introducing 50 D2W hybrid bonding machines. These devices are expected to be installed on the mass production line at the P5 plant in Pyeongtaek Park by the end of this year to produce next-generation high-bandwidth memories and logic semiconductors.