Yutaiwei announced that the board of directors of the company agreed to adjust the scale and investment direction of the 2026 plan to issue A-shares to specific targets. Prior to the adjustment, the total amount of capital raised for this distribution to specific targets did not exceed 1,361 billion yuan. The total amount of capital raised after deducting the issuance fee will be used for next-generation high-speed Internet network communication solution research and development projects for data center scenarios, next-generation high-speed communication chip R&D and industrialization projects for automotive scenarios, and supplementary working capital. After the adjustment, the total amount of capital raised for this distribution to specific targets does not exceed 1,061 billion yuan. The total amount of capital raised after deducting the issuance fee will be used for next-generation high-speed Internet network communication solution research and development projects for the data center scenario and next-generation high-speed communication chip R&D and industrialization projects for the automotive scene.

Yutaiwei announced that the board of directors of the company agreed to adjust the scale and investment direction of the 2026 plan to issue A-shares to specific targets. Prior to the adjustment, the total amount of capital raised for this distribution to specific targets did not exceed 1,361 billion yuan. The total amount of capital raised after deducting the issuance fee will be used for next-generation high-speed Internet network communication solution research and development projects for data center scenarios, next-generation high-speed communication chip R&D and industrialization projects for automotive scenarios, and supplementary working capital. After the adjustment, the total amount of capital raised for this distribution to specific targets does not exceed 1,061 billion yuan. The total amount of capital raised after deducting the issuance fee will be used for next-generation high-speed Internet network communication solution research and development projects for the data center scenario and next-generation high-speed communication chip R&D and industrialization projects for the automotive scene.