Faced with the continuous upgrade demand for high-performance hardware in applications such as high-end AI servers and core switches, Oshcon successfully developed an N+M structure and three-material mixed pressure embedded ultra-high-rise PCB, and made a key breakthrough in the highly reliable mass production process, providing technical support for the stable manufacturing and reliable delivery of high-end PCBs. The product uses an ultra-high-rise N+M structure and integrates three material systems: embedded materials, high-speed materials, and ordinary high-Tg materials, to achieve comprehensive breakthroughs in ultra-thick plates, micropores, high thickness diameter ratio, high density interconnection, and strict impedance control.

Faced with the continuous upgrade demand for high-performance hardware in applications such as high-end AI servers and core switches, Oshcon successfully developed an N+M structure and three-material mixed pressure embedded ultra-high-rise PCB, and made a key breakthrough in the highly reliable mass production process, providing technical support for the stable manufacturing and reliable delivery of high-end PCBs. The product uses an ultra-high-rise N+M structure and integrates three material systems: embedded materials, high-speed materials, and ordinary high-Tg materials, to achieve comprehensive breakthroughs in ultra-thick plates, micropores, high thickness diameter ratio, high density interconnection, and strict impedance control.