Traditional PCB-based embedded packaging solutions face problems such as insufficient heat dissipation capacity, poor thermal expansion compatibility, and long-term reliability challenges in high power and high heat flow density application scenarios. In response to the above technical bottlenecks, Fullerwood Semiconductor continues to innovate ceramic substrates in the field of advanced packaging, and has launched an embedded packaging technology solution based on DAB ceramic substrates to provide new technical options for the next generation of high-performance power modules. Compared with traditional PCB embedded solutions, DAB ceramic substrates use a direct-coated aluminum structure.

Traditional PCB-based embedded packaging solutions face problems such as insufficient heat dissipation capacity, poor thermal expansion compatibility, and long-term reliability challenges in high power and high heat flow density application scenarios. In response to the above technical bottlenecks, Fullerwood Semiconductor continues to innovate ceramic substrates in the field of advanced packaging, and has launched an embedded packaging technology solution based on DAB ceramic substrates to provide new technical options for the next generation of high-performance power modules. Compared with traditional PCB embedded solutions, DAB ceramic substrates use a direct-coated aluminum structure.