According to the CITIC Construction Investment Securities Research Report, with its ultra-high thermal conductivity and low coefficient of thermal expansion, diamond composites are currently being used in high-performance consumer electronics and AI servers. Looking forward to the future, in the short term, diamond-copper composites have high technical maturity and outstanding industrialization and cost performance, and are expected to be the first to be released; in the medium term, polycrystalline diamond hot deposition sheets are bonded to the chip, and the core breakthrough point is surface smoothness and curl control, which is expected to further mature in the next 1 to 3 years; in the long term, single-crystal diamond wafer-level bonding directly reaches the chip base, but due to size and cost, it is still being explored. Judging from the industrial value in the next few years, the technologically difficult MPCVD equipment and bonding equipment that can produce 8-inch polycrystalline diamonds are the core. Sector opportunities mainly focus on the progress of terminal manufacturers' diamond cooling solutions.

According to the CITIC Construction Investment Securities Research Report, with its ultra-high thermal conductivity and low coefficient of thermal expansion, diamond composites are currently being used in high-performance consumer electronics and AI servers. Looking forward to the future, in the short term, diamond-copper composites have high technical maturity and outstanding industrialization and cost performance, and are expected to be the first to be released; in the medium term, polycrystalline diamond hot deposition sheets are bonded to the chip, and the core breakthrough point is surface smoothness and curl control, which is expected to further mature in the next 1 to 3 years; in the long term, single-crystal diamond wafer-level bonding directly reaches the chip base, but due to size and cost, it is still being explored. Judging from the industrial value in the next few years, the technologically difficult MPCVD equipment and bonding equipment that can produce 8-inch polycrystalline diamonds are the core. Sector opportunities mainly focus on the progress of terminal manufacturers' diamond cooling solutions.