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ASE to launch automated 310mm panel-level packaging production line in H1 2027

PUBT·05/26/2026 13:00:55
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ASE to launch automated 310mm panel-level packaging production line in H1 2027
  • ASE Technology Holding developed an automated 310 mm x 310 mm panel-level packaging production line, shifting advanced packaging from wafers to panels.
  • Production start targeted for H1 2027, positioning the platform for AI accelerator and high-performance computing demand.
  • Design-rule consistency maintained across FOCoS and FOCoS-Bridge; line/space capabilities set at 2/2 µm, 8/8 µm.
  • Panel format lifts usable area to 96,100 mm2 per panel, aiming to raise die output per unit, boost throughput, cut cycle time.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. ASE Technology Holding Co. Ltd. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260526442808) on May 26, 2026, and is solely responsible for the information contained therein.