Datasea Establishes Engineering-Level Core Technology For Next-Gen Semiconductor Manufacturing Applications

Datasea Inc. (NASDAQ:DTSS) ("Datasea" or the "Company"), a Nevada-based technology company specializing in acoustic high-tech solutions and 5G+AI multimodal digitalization, today announced that it has achieved a foundational research breakthrough in its ultrasonic-enhanced nanoscale precision control technology, representing a step-change in the Company's technical architecture and underlying acoustic engineering capabilities. This milestone also marks the establishment of an engineering-level core technology architecture oriented toward next-generation semiconductor manufacturing applications.

The Company stated that this breakthrough reflects progress at the foundational research and architectural levels, rather than a single-point laboratory result. By systematically integrating ultrasonic enhancement mechanisms with ultra-precision composite manufacturing processes, Datasea is constructing a systems-level precision control architecture and related technical framework designed to address increasing complexity, stability, and nanoscale accuracy requirements in advanced semiconductor process environments.

This stage of R&D progress provides a technical foundation for subsequent engineering validation and application scenario exploration. The technology remains in the research and engineering validation stage and has not yet entered commercialization.