TSMC is speeding up the expansion of its advanced packaging production capacity in Taiwan, and both its AP8 and AP7 plants have advanced equipment installation schedules. The former is committed to expanding CoWoS production capacity, and is expected to begin installing equipment as early as April 2025, and mass production may begin in the second half of the year; the latter task is to increase SoIC technology production, which was originally scheduled to be installed at the end of 2025, but has now been brought forward to August. SoIC production is expected to double to 10,000 tablets this year, and double again in 2026.

TSMC is speeding up the expansion of its advanced packaging production capacity in Taiwan, and both its AP8 and AP7 plants have advanced equipment installation schedules. The former is committed to expanding CoWoS production capacity, and is expected to begin installing equipment as early as April 2025, and mass production may begin in the second half of the year; the latter task is to increase SoIC technology production, which was originally scheduled to be installed at the end of 2025, but has now been brought forward to August. SoIC production is expected to double to 10,000 tablets this year, and double again in 2026.