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Qualcomm applied for the issuance of US$4 billion bonds, divided into 5 tiers, with fixed interest of 5.000%-5.800%.

智通財經·11/09/2026 22:26:04
語音播報
Qualcomm applied for the issuance of US$4 billion bonds, divided into 5 tiers, with fixed interest of 5.000%-5.800%.