The reporter learned that the 24th China Semiconductor Packaging Testing Technology and Market Annual Conference will be held at Nanjing Fengda International Hotel from November 4 to 6. During the two-day conference, leading companies in the fields of semiconductor packaging and testing, chip design, glass substrates, advanced packaging and testing equipment, such as Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Bijiao Technology, BOE, and Yuntian Semiconductor, will exchange the latest development direction of advanced packaging through main forums, special reports, and supply-demand docking.

The reporter learned that the 24th China Semiconductor Packaging Testing Technology and Market Annual Conference will be held at Nanjing Fengda International Hotel from November 4 to 6. During the two-day conference, leading companies in the fields of semiconductor packaging and testing, chip design, glass substrates, advanced packaging and testing equipment, such as Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Bijiao Technology, BOE, and Yuntian Semiconductor, will exchange the latest development direction of advanced packaging through main forums, special reports, and supply-demand docking.