Today, the second phase of the advanced packaging pilot platform project of Hubei Star Technology Co., Ltd. was officially launched. According to its introduction, the project is the first mass production line for 3D advanced packaging in China. The total investment of the first phase and phase II of the Star Technology Advanced Packaging Comprehensive Test Platform exceeded 7 billion yuan, of which the second phase of the project started in October 2025. After the production line is fully completed, it can simultaneously carry 40 to 50 types of chips for pilot testing and risky mass production, as well as performance verification of 30 to 40 sets of domestic semiconductor equipment and materials.

Today, the second phase of the advanced packaging pilot platform project of Hubei Star Technology Co., Ltd. was officially launched. According to its introduction, the project is the first mass production line for 3D advanced packaging in China. The total investment of the first phase and phase II of the Star Technology Advanced Packaging Comprehensive Test Platform exceeded 7 billion yuan, of which the second phase of the project started in October 2025. After the production line is fully completed, it can simultaneously carry 40 to 50 types of chips for pilot testing and risky mass production, as well as performance verification of 30 to 40 sets of domestic semiconductor equipment and materials.