Orinno-backed Hongfucheng debuts on Shenzhen ChiNext board under ticker 301716

• Chengdu High-Tech Orinno Investment Group’s Ceyuan Capital-backed portfolio company Hongfucheng (301716) listed on Shenzhen’s ChiNext on Sept. 29.
• Hongfucheng develops thermal-management materials, including graphene thermal pads, targeting AI data centers, autos, 5G, consumer electronics.
• Orinno highlighted another ChiNext IPO at the same partner fund: CETC Siyi.
• Hongfucheng reported 178 granted patents as of Dec. 2025, including 72 invention patents.

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