Intel Foundry, ASML present High NA EUV production progress at SPIE Photomask conference

• Intel Foundry attended the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference to highlight progress on High NA EUV readiness.
• High NA EUV is in high-volume manufacturing at Intel, with more than 1,000,000 wafers processed across certification, R&D, and select production layers.
• Intel 18A layers patterned with High NA are meeting or exceeding performance versus comparable layers patterned on ASML’s 0.33 NA NXE EUV platform.
• The companies emphasized near-term High NA use with standard 6-inch masks, supported by reticle stitching and PDK solutions.
• Intel continues to push an industry shift toward 6x12-inch masks, aiming to align standards and infrastructure for future High NA scaling.

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