According to reports, TSMC has completed the development and verification of the 1.6nm A16 process and plans to mass produce it in the fourth quarter of this year. The process uses the backside power supply network technology “super power rail” to separate the power supply from the signal line and supply power from the back side of the wafer to reduce wiring bottlenecks, improve energy efficiency and performance, and maintain compatibility with existing designs. A16 targets the AI and high-performance computing markets. Compared with the enhanced 2nm process N2P, the A16 has an 8%-10% increase in performance at the same power consumption, a 15% to 20% reduction in power consumption, and an 8%-10% increase in chip density under the same performance. A16 is seen as an intermediate node in the transition to 1.4nm A14, which targets mass production in 2028. At the same time, TSMC continues to increase its advanced process and packaging production capacity. On the 11th, TSMC's board of directors approved a total capital expenditure of approximately US$29.442.5 billion for advanced processes and packaging.

According to reports, TSMC has completed the development and verification of the 1.6nm A16 process and plans to mass produce it in the fourth quarter of this year. The process uses the backside power supply network technology “super power rail” to separate the power supply from the signal line and supply power from the back side of the wafer to reduce wiring bottlenecks, improve energy efficiency and performance, and maintain compatibility with existing designs. A16 targets the AI and high-performance computing markets. Compared with the enhanced 2nm process N2P, the A16 has an 8%-10% increase in performance at the same power consumption, a 15% to 20% reduction in power consumption, and an 8%-10% increase in chip density under the same performance. A16 is seen as an intermediate node in the transition to 1.4nm A14, which targets mass production in 2028. At the same time, TSMC continues to increase its advanced process and packaging production capacity. On the 11th, TSMC's board of directors approved a total capital expenditure of approximately US$29.442.5 billion for advanced processes and packaging.