TSMC said a few days ago that it has made a breakthrough in the application of its CowOS advanced packaging technology in the field of AI chips, and the production yield of some products has increased to 98% to 99%. According to He Jun, TSMC's Deputy General Manager of Advanced Packaging Technology and Services, this excellent yield performance is mainly aimed at CowOS packaging AI products based on 5.5 times the mask size. Currently, the 5.5 times mask size CoWOS has entered mass production, and it is expected that CoWOS will be expanded to 14 times the mask size in 2029.

TSMC said a few days ago that it has made a breakthrough in the application of its CowOS advanced packaging technology in the field of AI chips, and the production yield of some products has increased to 98% to 99%. According to He Jun, TSMC's Deputy General Manager of Advanced Packaging Technology and Services, this excellent yield performance is mainly aimed at CowOS packaging AI products based on 5.5 times the mask size. Currently, the 5.5 times mask size CoWOS has entered mass production, and it is expected that CoWOS will be expanded to 14 times the mask size in 2029.