EnSilica Lands EUR1.7 Million Deal for Satellite Payload ASIC Program; Joins EU Project

06:10 AM EDT, 08/03/2026 (MT Newswires) -- EnSilica (ENSI.L) secured a contract worth 1.7 million euros for the second phase of a satellite payload communications application-specific integrated circuits, or ASICs, program from a European satellite manufacturer. Under the deal, which follows a feasibility contract, the British chipmaker will develop the system architecture, signal processing algorithms and systems demonstrator device required for the ASIC to enter the full development phase, according to a Monday release. Delivery is expected over the next 10 months. EnSilica also joined the 5G-aNTeNna project, a European consortium developing a compact user terminal for the European Union's IRIS satellite constellation, to provide the key application-specific standard products for the terminals.