As the global advanced packaging production capacity continues to be scarce, the domestic packaging and testing industry has ushered in a wave of large-scale expansion. Leading companies such as Changdian Technology, Huatian Technology, Shenzhen Technology, Tongfu Microelectronics, and Shenghe Jingwei have expanded their advanced packaging capacity, focusing on high-end storage, power semiconductors, and high-performance computing packaging tracks. At the same time, the industrial chain will further enhance the level of ecological collaboration and accelerate the autonomous and controllable process of advanced domestic packaging. Looking at the market outlook, according to market research firm Yole estimates, the global advanced packaging market is 54 billion US dollars in 2025, and is expected to increase to 109 billion US dollars by 2031. According to data treasure statistics, up to now, there are 7 advanced packaging concept stocks that have been investigated 5 times or more by the agency since this year, including Dinglong Co., Ltd., Tongfu Microelectronics, Qipai Technology, Weitong, Jingzhida, Blue Rocket Electronics, and Jinhaitong. Dinglong Co., Ltd. received a total of 20 institutional surveys during the year, with the highest research frequency. When surveyed by an agency recently, the company said that the company has deployed more than 40 high-end wafer photoresist products, and various models continue to carry out verification tests at leading domestic fabs; currently, 8 ArF and KrF photoresists have achieved stable batch supply, and continue to expand orders from new customers. Semiconductor packaging PI materials have deployed 7 products, 2 of which have received orders from many customers.

As the global advanced packaging production capacity continues to be scarce, the domestic packaging and testing industry has ushered in a wave of large-scale expansion. Leading companies such as Changdian Technology, Huatian Technology, Shenzhen Technology, Tongfu Microelectronics, and Shenghe Jingwei have expanded their advanced packaging capacity, focusing on high-end storage, power semiconductors, and high-performance computing packaging tracks. At the same time, the industrial chain will further enhance the level of ecological collaboration and accelerate the autonomous and controllable process of advanced domestic packaging. Looking at the market outlook, according to market research firm Yole estimates, the global advanced packaging market is 54 billion US dollars in 2025, and is expected to increase to 109 billion US dollars by 2031. According to data treasure statistics, up to now, there are 7 advanced packaging concept stocks that have been investigated 5 times or more by the agency since this year, including Dinglong Co., Ltd., Tongfu Microelectronics, Qipai Technology, Weitong, Jingzhida, Blue Rocket Electronics, and Jinhaitong. Dinglong Co., Ltd. received a total of 20 institutional surveys during the year, with the highest research frequency. When surveyed by an agency recently, the company said that the company has deployed more than 40 high-end wafer photoresist products, and various models continue to carry out verification tests at leading domestic fabs; currently, 8 ArF and KrF photoresists have achieved stable batch supply, and continue to expand orders from new customers. Semiconductor packaging PI materials have deployed 7 products, 2 of which have received orders from many customers.