The Securities Regulatory Commission agreed to Hongfu Cheng's IPO registration on the Shenzhen Stock Exchange

The Zhitong Finance App learned that on July 10, the Securities Regulatory Commission issued the “Approval to Register the Initial Public Offering of Shares by Shenzhen Hongfucheng New Materials Co., Ltd.” According to reports, Hong Fu Cheng plans to be listed on the Shenzhen Stock Exchange. Huayuan Securities is the sponsor and plans to raise 1,2203.9 billion yuan.

According to the prospectus, Hongfucheng is a national-level specialized and focused “little giant” enterprise focusing on R&D and industrialization of advanced electronic functional materials and devices such as thermal management, electromagnetic shielding, and wave absorption. Its products mainly include thermal interface materials, electromagnetic shielding and wave absorption materials. Graphene thermal conductive gaskets and metal-carbon-based composites independently developed by the company have entered the thermal interface material supply chain of major AI chip companies around the world and are supplied in batches.