Applied Materials to acquire ASMPT’s NEXX advanced packaging equipment business

• Applied Materials agreed to buy ASMPT’s NEXX business, adding panel-level advanced packaging deposition tools to its semiconductor equipment portfolio.
• Deal targets growing demand for larger chiplet-based AI packages, supporting a shift from 300-mm wafers to panel form factors up to 510 by 515 millimeters or more.
• NEXX brings panel-level electrochemical deposition technology, expanding Applied’s offering for fine-pitch interconnect wiring in advanced packaging.
• Transaction expected to close within next several months, subject to customary closing conditions.
• NEXX operations will remain based in Billerica, Massachusetts within Applied’s Semiconductor Products Group.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202605032000PRIMZONEFULLFEED9712065) on May 04, 2026, and is solely responsible for the information contained therein.