When surveyed by the agency, Leon Micro said that the current 12-inch heavy duty silicon wafer production capacity is climbing rapidly, and the current operating rate is about 80%. The company's 12-inch silicon wafers have covered logic circuits and storage circuits at technology nodes above 14nm, as well as image sensor devices and power devices for technical nodes required by customers, and have entered the supply chain of some memory chip customers. The company's light-blended polishing sheet product line will focus on leveraging the company's epitaxial technology strengths, developing key products such as BCD light-doped borosilicon wafers and CIS light-doped borosilicon wafers, focusing on developing light-doped silicon wafers for advanced processes, and paying more attention to the technical strength and quality standards of the products. The company will not actively participate in the price war.

When surveyed by the agency, Leon Micro said that the current 12-inch heavy duty silicon wafer production capacity is climbing rapidly, and the current operating rate is about 80%. The company's 12-inch silicon wafers have covered logic circuits and storage circuits at technology nodes above 14nm, as well as image sensor devices and power devices for technical nodes required by customers, and have entered the supply chain of some memory chip customers. The company's light-blended polishing sheet product line will focus on leveraging the company's epitaxial technology strengths, developing key products such as BCD light-doped borosilicon wafers and CIS light-doped borosilicon wafers, focusing on developing light-doped silicon wafers for advanced processes, and paying more attention to the technical strength and quality standards of the products. The company will not actively participate in the price war.