Addor Capital invests in chip packaging substrate maker Xinai Technology

• Addor Capital completed an investment in Xinai Technology, a Nanjing-based developer and manufacturer of advanced semiconductor packaging substrates founded in 2021.
• Proceeds will fund advanced packaging substrate capacity expansion for AI and chiplet architectures, supporting larger-scale deliveries.
• Xinai has entered leading domestic AI chipmakers’ supply chains, with monthly high-end substrate production exceeding 30 million units.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Jiangsu Addor Equity Investment Fund Management Co Ltd published the original content used to generate this news brief on October 22, 2026, and is solely responsible for the information contained therein.