Nvidia CEO Hwang In-hoon will meet with Samsung Electronics Chairman Lee Jae-rong and SK Group Chairman Choi Tae-won again in New York on the 28th local time. It's been about two months since the three met in San Francisco in July. HBM was the topic that the industry was most concerned about during this meeting. As the performance of AI accelerators has improved dramatically, HBM, which can transfer massive amounts of data at high speed to the GPU, has become the core device that determines the performance of Nvidia's next generation products. Samsung plans to enter the AI chip market by integrating memory, foundry, and advanced packaging. This means that the relationship between the two parties is expected to expand from simple HBM supply and demand to full-process AI chip production.

Nvidia CEO Hwang In-hoon will meet with Samsung Electronics Chairman Lee Jae-rong and SK Group Chairman Choi Tae-won again in New York on the 28th local time. It's been about two months since the three met in San Francisco in July. HBM was the topic that the industry was most concerned about during this meeting. As the performance of AI accelerators has improved dramatically, HBM, which can transfer massive amounts of data at high speed to the GPU, has become the core device that determines the performance of Nvidia's next generation products. Samsung plans to enter the AI chip market by integrating memory, foundry, and advanced packaging. This means that the relationship between the two parties is expected to expand from simple HBM supply and demand to full-process AI chip production.